Hi all,
I would to do RT and HT Nanoindentation on alloys.
For RT nanoindentation I am using hot mounted samples using bakelite powder.
But since bakelite can't withstand 400-500 degree celcius. Can somone suggestion me based on your experience how can I do the test at this temperature considering that samples are 30 micron thin ribbons. I was thinking of sticking them to a metal substrate. Can someone suggest any heat resistant glue that can withstand this temperature or any other method that maybe useful. As prior to the test I need to metallographically polish the samples to mirror finish.
Any suggestions in this regard would be appreciated, if you've done such tests.
https://www.sciencedirect.com/science/article/abs/pii/S1359028615000145
https://www.tedpella.com/SEMmisc_html/SEMpaint.htm.aspx#16057
try one of these
Regarding your question there are specific ceramic glues that are heat resistent.
In any case I dont reccomend at all for the RT nanoindentation to embed metal samples in bakelite the reason is that you will increase a lot the compliance of the system and you will end up with a measured displacement much higher due to the compliance of the bakelite so your results will be affected by an high error and your measured young modulus or hardness will appear to be lower than expected.
All in all : To compare RT and HT results you need to use the same type of adhesive for the samples otherwise you introduce an error that might be relatively really high...
From the Ted Pella catalogue above reccomended, the correct glue it is not the carbon based or nickel based as pointed out but this one: https://www.tedpella.com/adhesive_html/Adhesives-Nonconductive.htm#_16026
other manufacturer have something similar.... in any case you should go for a ceramic paste as ceramic have high elastic modulus also at high temperature i.e. they will minimize the compliance of your system
Ok thanks for your reply and suggestions.
I'll consider your suggestions.
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