I haven’t used the system you are using though. But from my electrodeposition experience, I found that adhesion of electroplated layers often depend on the pH of the solution. If the solution is too acidic it may peel off, if it is too basic the same thing may happen. So, it is better to optimise the pH value before finally deciding the parameters.
Actually, for my case, the seed layer was not thick enough to hold the electroplated layer. Finally, I was able to make nice and clean 100*100*1.2 um Au pillars! Cheers!