Irvine, CA – Nanovea introduced its patent pending breakthrough method of reliably acquiring yield strength through indentation; ultimately replacing the traditional tensile testing machine for yield strength measurement.
Traditionally yield strength has been tested by using a tensile testing machine, a large instrument requiring enormous strength to pull apart metal, plastic and others. The yield strength (also known as yield point) of a material in engineering (and or materials science) is the point of stress that a material starts to deform plastically. Before reaching the yield point a material will deform elastically but returns to its original shape when stress is removed. A crucial material property for nano and micro related materials found in advancing industries such as biomedical, microelectronics, energy and many others. Until now the most reliable way took large machine effort, sample preparation, and or was impossible to perform on small samples and localized areas.
Read more: http://www.nanovea.com/Application%20Notes/yieldstrengthtesting.pdf
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