Dear all,

We have an issue with Au wire bonding on PCB

in electronic industry. We performed analysis of the surface and we found Cyanide (CN) and polydimethylsiloxane (PDMS). The source of CN contamination is from Au plating bath from PCB manufacturer. We washed with our current washing process commercial solution pH around 11 and with/without sonication and plasma process still no success to remove the contamination and no improvement in boding.

If anyone has a simillar experience I appreciate to share with us. If there is any technical /scientific article please inform me.

I appreciate your help and support.

Best regards,