Copper oxide nanopowder is dense compared to alumina, silica, and titania and thus show poor surface wettability and stability when dispersed in or water or ethylene glycol.
In order to solve this stability issue, researchers take advantage of either surfactants to add charge to particle surface thereby reducing surface tension, energy to disrupt and keep agglomerates apart, or combination of the two to achieve balanced condition.
Among the available surfactants, anionic surfactant sodium dodecyl sulphate (SDS) is shown to have better steric effect against copper oxide dispersions in water or ethylene glycol even at higher particle loading.
My biggest challenge is that, i have made several attempts to stabilize copper oxide nanopowder in water, ethylene glycol, and ethylene glycol-water mixtures using recommended doses of SDS (10 wt.%), 1 Hr high intensity ultrasonication (700 Watt, 20 kHz), and adjusting of pH to values of 6/8 yet unsuccessful. The particle used to appear homogenized but then begin to settle after 15 mins of the treatment process.
Any suggestions on how to disperse copper oxide nanoparticles in water or ethylene glycol water mixtures. What is the suitable dispersant/s for H-bonding organic solvents?
Appreciate if you could share your experiences on this topic.
Kindly provide relevant materials or web link/s to standard materials for powder dispersion.