When implementing metal gate of MOSFET or FinFET, only TiN was used, but I wonder why when implementing Buried Word Line DRAM, tungsten is used as Metal Gate and TiN is used only as Barrier Metal. Can't I just form Word Line with TiN?
maybe you can find answer in this paper
10.1109/IRPS.2014.6860602
Could you recommend some articles on Urban Transportation System optimization and Innovation?
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