For Sn and Fe sputtering targets bending of plasma occur; we need nearly focused plasma of these targets. Even after increasing power, results remain the same.
basically, there can be two main reasons: first, magnetrons in the deposition system do not have good configurations. Second, a magnetic target is used, which is your case. Typically, we cannot change the magnetron strength and configurations, so you should consider other ideas to decrease this effect when you have a magnetic target, like Co and Fe.
I worked with Co + another target and had the same situation. The good point about our deposition system was that we had this possibility to physically increase the distance between the magnetrons, not magnetron-to-substrate distance. So, it helped a lot. I am not sure if changing power can help significantly.
Check the grounding of sputtering system.The sputtering voltage should be low. Increase the pressure in the chamber.
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