I use electroplating to deposit Cu on Si wafer already seeded with thin Cu layer. Then I pattern it with insulating polymer and dip in electroplating bath. out of multiple copper seeded surfaces , few get electroplated while others gets etched, regardless of any electrical supply. it appears that the reaction is taking place in forward direction in one place and reverse in another spot. how is this possible.
Akula Komuraiah
may be fluctuations in concentrations, current, conditions of electrodes may be reason
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