There are so many books on thin films which clearly talks about the advantages of every PVD techniques. It totally depends on what you call 'better film quality'. There is not one PVD technique which is better in all aspects. If you are looking for a good step coverage, faster deposition rate, and utilize all the material efficiently, E-beam evaporation can be preferred. Sputtering gives you good control on the thickness and density of the films.

While sputtering (particularly ion beam sputtering) produces better film quality and uniformity—which can translate to higher yield— it is also more costly and complex than evaporation. ... Any thin film PVD process decision must weigh the right balance of system cost, yield, throughput and film quality

Really depends on which materials you use and for which purposes. In general, if the substrate does not degrade under the bombardment by sputtered atoms with very high kinetic energy then sputtering is a more favorable deposition technique, in comparison to EB evaporation, mostly because of better structural properties and stoichiometry of deposited thin films.

it depends on what you want and you can manipulate the preparation condition , to get the optimum for your application