Power density = rf power applied/ 3.14 * (radius of the target)^2

Is this correct?

I have found some mismatches in some papers, am I missing any other parameter.

Dr. Sutapa Badyakar

Regarding the distance between target and substrate. It should be measured from the edge, center of the target to the substrate (mm), and mask to the substrate (mm) for the magnetron sputtering.

Regarding cooling, the chiller must be situated in an environment with room temperature (below 25 degrees) or cool down the surrounding so that the chiller could reach the operating temp. Also, one can try adding chilled water to the reservoir and wait for some time.

Use 5 W/cm^2 and 10 to 20 cm distance between Si target and substrate