We are making Si solar cells (n-type emitter, p-type base), where the rear contact (with base) is made by depositing Aluminum. The purpose is to create a p+ BSF layer and the rear contact altogether by depositing 800 nm Aluminum. To ensure that Al diffuses to the bottom of the base and creates a BSF layer, the samples are put in furnace (1000 degC for 10 min) after Al deposition, and then cooled down. Front contact is 500 nm Ag. The resulting cells give good Voc and Jsc, but the fill factor is consistently low (

More K A S M Ehteshamul Haque's questions See All
Similar questions and discussions