Hi All:

I have been experimenting on using "organic deposition method (OD)" and "aqueous deposition method (AD)" to deposit Cu onto Carbon nanotube sheet, the details of these two methods can be found in publication "the influence of Cu electrodeposition parameters on fabricating structurally uniform CNT-Cu composite wires", and the link of this publication is listed below:

https://www.sciencedirect.com/science/article/pii/S2352492817301678

OD is a very slow process and can deposit Cu particles with few microns in size, however, after the vacuum annealing process, Cu/CNT sample showed negligible/almost zero contribution to CO2 reduction, judging from the SEM images (attached in the file), I believed that prefect spherical shape provides very few active sites thus hindering the CO2 reduction, please correct me if this statement is not scientifically accurate.

Regarding the AD process, itself is very fast and difficult to control, most of the time we will end up with huge chunk of Cu platelets without any nanomorphologies, theoretically it will not be beneficial for the CO2 reduction.

Therefore I am seeking advices on the improvement of these two deposition methods as well as any suggestion on new deposition approaches, the end goal should be CNT with uniformly distributed nano/micron sized Cu particles with many active sites.

Thanks in advance

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