I want to get as much as the flatness of e-beam evaporated Au on Si02/Si wafers. So I want to anneal au deposited Si02/Si wafers. The thickness of Si02 is 2nm. Is there any appropriate time and thickness of Si02 (because I do not want to diffuse au into Si02)to get the flatness so I can transfer to the small pieces using the template Stripping Process?
Hi Anish,
Gold normally does not adhere to SiO2. It usually sticks for sometime if you use e-beam or PVD, but after a while, usually hours, you can just pull it off. Using an anneal will only accelerate this process and the film will buckle, whatever your intentions are to make it more flat.
HI,
Thank you for your information!
This means annealing does not help.
Can you give me some papers related to it?
Annealing has side effects, SiO2 thickness may change, Au may penetrate, delamination of Au film,... But u did not share ur application.. Accordingly u can decide..
- Badges
- Science topic
- Similar topics
- Engineering
- Materials Engineering
- Annealing