I am currently working on optimization of TiNi thin film deposition using magnetron sputtering. I was able to obtain a free standing film using a single target with the following parameters.
Ar flow: 15SCCM
Pressure: 0.5 mbar
Stand off distance: 100mm
Power: 300W
rotation: 10rpm
While co-sputtering, I used 150W for two targets keeping other parameters same but I was not able to obtain a free standing film. The film curled up and broke. It will be really helpful if someone can explain me the changes that will happen to the plasma while co-sputtering.