Silicon microparticles(1-2 micrometer) coated with Ag particles by 0.45 mmol AgNO3. The obtained Ag coated silicon microparticles were immersed in a solution consisting of 4.8 M HF and 0.3 M H2O2 for etching. Given the above, a porous structure does not eventually form. where is the problem from?
I did it according to the attached article.
before being coated with 3d Ag try to get porous silicon firstly
Dear Hamidreza Ravanbakhsh
Wish you be fine and healthy
In agreement with Mr. Nadir Fadhil Habubi, please have a look at the files attached. You may find the mixture of HF/HNO3 as a better etching agent of silicon. The silicon etching rate by this mixture is higher than that with HF alone.
Hope that helps
Take care buddy.
If you want to prepare the porous silicon, your substrate should contain hols. That means, your substrate should be doped with boron for example in order to be p-type doped silicon. Otherwise, if your substrate is n-type doped silicon you have to illuminate this substrate during the etching process to generated the electron-hole pair and the hole will be used to etch to silicon forming the porous structure. For more details, you can see the Lehmann et Gösele mode.
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