Will be depositing negative resist onto gold coated substrates so would need resist to adhere reasonably well. Non complex resist development and processing would be ideal also.
Any feedback would be greatly appreciated!
Ross
Hello Ross,
You could try the ma-N 2400 series from 'micro resist technology'. Their ma-N2401 product provides a film thickness of 100 nm. I have successfully used ma-N2403 to create reproducible arrays of structures of approximately 50 nm.
Adhesion to Au should be okay, however ensure a suitable dehydration step (e.g., 200 oC). You could also try an oxygen plasma step.
You could also look at the AR-N 7500 series from 'ALLRESIST'. Their AR-N 7500.08 provides a 100 nm film thickness at 4000 rpm.
I've appended links to the datasheets for you. Hope it helps. There may be other suitable resists that others can recommend.
Jules
http://www.microchem.com/PDFs_MRT/ma-N%202400%20overview.pdf
http://www.allresist.com/wp-content/uploads/sites/2/2014/03/allresist_produktinfos_ar-n7500_englisch.pdf
Really appreciate your help Jules. Both resists you suggested look good - Just need to decide which is better for application!
Ross
Hi Ross,
even some time has passed already. There is a further suggestion that could be interesting for you: resist series AR-N 7520 provided by Allresist. There is also a discharging coating available: Electra 92 AR-PC 5091.02. For further information you could contact [email protected]
With best regards
Christian
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