Hi,

I need to deposit SiO2 on top of sputtered gold films and I find that tha adhesion between both layers is too bad. I ca not use any other material as it will interfere in the performance os the device.

I am thinking in testing a O2 plasma between the Au and the SiO2 depositions, a BIAS, a time of codeposition...

Anyone has experience in this multilayers? If so, I will really appreciate a suggestion or hint.

Thank you very much,

Ana

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