it may be helpful.

http://ieeexplore.ieee.org/document/7757279/?reload=true.

Many thanks for the link. I reviewed the paper and it contains quite helpful data. However, it is more dedicated to the effect of ECAP process on the phase distribution, grain refinement, hardness and drift of the transformation temperatures. The amount of plastic deformation upon each pass is not indicated in the paper, while determining plastic strain in forming process at high temperatures is difficult, particularly in metal extrusion processes, as there is no access to the material until it has ejected from the die or the billet is removed. For copper this plastic deformation may reach up to 7% depending to the die angle and temperature and the speed of the compression; while in tension stress-strain curve the sample fractures after around 1% of the plastic deformation.

I am more curious in any research on the characterization of the second plateau in SMAs (as depicted in attached image, schematically), the micro mechanism and/or modelings.

Hi,

You say: "...the loading beyond the A to M transformation stresses" but actually this is not loading but unloading, so how can you look for plastic deformation here? I don't know exactly what you mean but maybe looking at fatigue papers might help.

Miguel, thanks! May be the picture is confusing! I mean continuation of loading till passing the second stress plateau. As I schematically showed in Fig bellow. Path C-D in the picture. Very rare researches studied the mechanism and less researches have implemented in the models. I am looking to more studies on it.

Ok, now I get you. Please try this paper as I remember they talk about that.

Article Thermomechanical behavior of 55Ni45Ti Nitinol

Thanks for presenting the valuable paper @ Prof. Miguel. Its very insightful. Best regards

Dickson

Great job! thank you very much. Indeed, it is what I am looking for, taking into account the "plastic flow stress"

Regards

Pejman