We have a cathodic arc PVD system which uses hollow cathode arc (plasma) with Ar as a prior cleaning step. Now our idea is to use this set up for plasma nitriding of SS 3xx series. The plan is to introduce N2 rather than Ar from hot hollow cathode while the workpoece would be immersed in this plasma, and if we have a correct bias then we should be able to achieve some sort of N implantation on the surface leading to sort of plamsa nitriding. I would like the experts to weigh in, on this idea. Thanks in advance.