I'm needing to perform a modal analysis of a composite plate. For instance a plate may be 8 layers with 0/90/45/90 stacking sequence. Then in between the 4th and 5th layers there is some small region of delamination (teflon tape), where the layers are not bonded. How can I model this in ANSYS? Should I just define the connections such that the region of delamination is not connected? Or perhaps using a CZM interface?