Dear experts,
Since wafers, for example, Si may have 100 or 111 or other orientation.
Is it proper to cut such particularly oriented wafers using normal glass cutter?
Is there any impact on the wafer's orientation if we use normal glass cutter? (Is this method alters any other properties?)
Up to now I prepared hundreds of silicon wafers and use a simple diamond scriber I think there is no any harm on the substrates.
Well, I've used normal glass cutters (with diamond tip) for this application before, and it worked great, without damage to the substrate.
I have used a simple glass cutter and did not see any adverse effects.
We use a conventional old glass cutter without any problems.
Good luck!
Glass cutter may cause demage to substrate, diamond coated wheel/saw is best choice, in other hand laser technology is one of the best way to cutting & dicing the wafers.
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