What parameters i have to adjust to grow homogenous, uniform and smooth structures (spin valves or magnetic tunnel junctions) in Magnetron Sputtering like Argon Pressure Flow, doposition pressure, DC/Rf power (low or High?)
Low pressure and low deposion rate tipically improve the stack. Thermal treatments in-situ or post-annealing ex-situ are an important degree of freedom as well.
Besides these factors you mentioned, you may also need to pay attention to the vacuum condition, which is very important, and also, the bias voltage for some compounds sputtering.