Hi everyone,
I'm using SU-8 as an adhesive bonder (Kapton on silicon), but once I hardbake the SU-8 layer at 150C, the remaining solvents in the SU-8 evaporate and make bubbles, and essentially deteriorate the adhesion quality. I tried soft-bake or PEB the SU-8 at higher temperatures or hardbake with slow ramps but they weren't helpful.
Any suggestions would be appreciated,
Thank you!
Using a vacuum oven or lower temperature with a long duration should work in your case.
Please do prebake before the adhesive bonding process....check it's glass transition temperature....prebake at the onset of glass transition temperature
Dear Amirhossein Omidvar ,
Prebaking at 65 °C and 95 °C is recommended for most of the SU-8 series photoresists.
Before processing the SU-8 make sure your substrate is dehydrated (keep the substrate on hot plate or in oven) after rinsing in nitrogen.
Coat the sample and make sure that there is no bubble is present before spin coating (air bubbles generates during pouring of PR). For this you may wait for few sec/minutes.
Once coating is done prebake the substrate at 65 °C and 95 °C as suggested in the SU-8 data sheet.
Higher baking temperature increases the evaporation rate of the solvent, which sometimes causes the bubble formtation in the resist film.
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