Dear Lee,

Your question is very wide, it's depend on the layer deposited and metal substrate, you can control the time duration, current density, voltage, PH, the surface of anode, distance between anode and cathode and ets.,

If you would like to continue, give me your exact information.

Regards

Amin 

Primarily, it would be based on the optimization of parameters such as potentials and time.

The critical parameter in electroplating is "current density" - measured in A/m2. And the uniformity of current density at the object to plate.

Lower current densities are only increasing the time it takes to deposit a particular coating thickness.

If current density is too high, the deposition is no longer uniform. Instead, surface roughness is increased due to forming "dendrites" (that contribute to non-uniformity of current density - thus increasing the deposition of dendrite-like structures).

A polishing step following electroplating is capable of 'annealing' the surface, reducing surface roughness - given that the plating is polishable.

Dear Lee,

Your question is very wide, it's depend on the layer deposited and metal substrate, you can control the time duration, current density, voltage, PH, the surface of anode, distance between anode and cathode and ets.,

If you would like to continue, give me your exact information.

Regards

Amin 

Mr. U. Dreher  can you give any reference  paper or book for non uniform deposition due to current density