01 September 2018 3 5K Report

During my plasma treatment I observe increase in surface temperature on powered and grounded electrode in CCP-RF low pressure configuration.

At increased RF power, temperature of powered electrode increases.

In my case electron neutral collision frequency is higher than applied rf frequency i.e. 13.56 MHz. Thus ohmic heating is dominating.

Please explain me how to calculate the surface temperature on both powered and grounded electrode ? Any theory / equations help if we know the density and temperature of plasma ?

Thanks in advance,

Purvi Dave

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