I am new to MEMS processing. As a part of my work I need to make device on thin quartz glass (150 micron- 2 inch). Handling of thin quartz wafer alone is very difficult and broken few samples while doing fab process. Please suggest temporary bonding (5 days) for quartz wafers with silicon wafers.
Spin coat SU-8 on one surface of the quartz wafer and one surface of the support wafer. Pre-bake both to the desired temperature. Attach both together and expose the sample with a UV lamp in such a way that the UV reaches the bond interface through the quartz wafer. Post-bake the bonded sample.
.The bond will be good. You can release the quartz wafer in a later day with different solutions as well.
You can use wax wich is soluble in acetone (to remove the bonding) or BCB wich is soluble in mesitylene (to remove the bonding). I also think that you could generally use any classical photoresists wich are commonly soluble in acetone (to remove the bonding).
- Badges
- Science topic
- Similar topics
- Engineering
- Control Theory
- Control Systems
- Control Systems Engineering