Hello,
I'm going to spin coat PR on ITO Glass.
But my process, After the spin coating, holes are formed in the photoresist.
So I can`t proceed with the next process(Develop, Etching ...)
The surface was clean when Polyimide solution (other solution) was coated under the same conditions.
However, only coating Photoresist creates holes on the surface.
- My spin coating conditions are as follows.
Cleaning : Acetone, IPA, DI-water
Dehydration Bake 200'C
Oxygen plasma treatment
Spincoat at 30sec 3000rpm (I tried other speed, but the results were the same.)
Dear Vadim S. Gorshkov
.Thank you for your answer.
I feel the same way. Maybe that's why we do research constantly. But I think, the situation I'm going through is not normal. So many holes will be etching to the parts that are not needed in the etching process.
The size of the hole is about 200um and the number of holes is abnormally high.
Anthony Ryu
Here is a good lithography troubleshooting guide (https://www.microchemicals.com/technical_information/lithography_trouble_shooting.pdf)
One thing i've found in my previous process which was almost exactly the same is yours was that when I do lithography in a multi user facility is to ensure the spinner is clean. I would typically wipe it down before my spin. And also ensure the PR bottle is free of any debris prior to dispensing the PR.
When you spin coat are you covering most of the substrate prior to your spin? or are you only covering the middle portion?
Was the polyimide underneath multiple layers?
-Adam
Article Large-area photonic lift-off process for flexible thin-film ...
Adam Weidling
Thank you for your help.
Your data is very helpful. The polyimide image is attached only for comparison.
Both objects are a first-layer coated directly on the ITO Glass.
I'll try the way you recommended it.
Thank you !
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