I am currently facing an issue regarding the control of the humidity in my workspace. I am using a PU adhesive to bond to elastomeric substrates and i was wondering if i could decrease cure rate for better handling of the operation without hindering its mechanical characteristics ?? I considered using MEC to wipe substrates before adhesion but i don't know if it can provide required results.
I would be grateful if you could provide me some insight into this subject .
Dear Nadhem Jallouli, you can play on the operating parameters, such as temperature, catalyst, and volume of reactants, and so on. Please check the following for further information. My Regards
https://doi.org/10.1016/j.ceja.2020.100051
https://www.researchgate.net/post/Hi-all-Is-there-any-crosslinking-retarder-for-polyurea-polyurethane-polymer
https://www.researchgate.net/post/Delayed_action_catalysts_for_Polyurethane
Dear Nadhem Jallouli
Literatures that may be useful are,
https://www.adhesives.org/adhesives-sealants/adhesives-sealants-overview/adhesive-technologies/chemically-curing
Article Mechanism and kinetics of moisture-curing process of reactiv...
https://www.adhesivesmag.com/articles/91824-extending-moisture-cure-polyurethane-binders-with-water
If the system contains a catalyst change or reduce that. Catalysis in PU chemistry is complex and there are many catalysts available which specifically catalyse PU reactions DBTL being the most general
Another route is to reduce the pH I have done this in the past by adding a small amount of benzoyl chloride
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