I would like to achieve uniform PR(photoresistor) coatings as thin as 300 nm on a thick glass substrate. SU-8 PR is thinking of using with dilution. The size of the substrate is 160*120mm rectangular fused silica and the thickness is 20mm. The uniformity of the desired PR thickness is less than 7%.
The spin coating method cannot provide a uniform coating on a rectangular substrate due to the edge bead effect. Therefore, we are testing slit coating or ink-jet coating methods, but a uniform and thin 300nm PR coating is not achieved.
By what method can PR be uniformly coated with about 300 nm of PR on a wide rectangular substrate? We are also considering changing the PR if necessary.
Old stuff:
SPIN COATING FOR RECTANGULAR SUBSTRATES
A thesis by GREGORY A. LUURTSEMA, July 11, 1997
http://bcam.berkeley.edu/ARCHIVE/theses/gluurtsMS.pdf (not available 2023-12-19)
Carcano, G., Ceriani, M. and Soglio, F. (1993), "Spin Coating with High Viscosity Photoresist on Square Substrates - Applications in the Thin Film Hybrid Microwave Integrated Circuit Field", Microelectronics International, Vol. 10 No. 3, pp. 12-20
https://doi.org/10.1108/eb044507
Best Regards
Stefan Baunack
Hyun-Ju Cho Dip coating provides uniformity on large substrates, but precision in achieving specific thicknesses like 300 nm may be challenging, requiring control of withdrawal speed and solution viscosity. The process involves thorough cleaning of the fused silica substrate to prevent adhesion issues and maintain controlled temperature and humidity to minimize film thickness variations.
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