I currently clean the SiO2 substrate with Piranha solution for 1-2 hours. I've also used Cr and Ti as the adhesive layer and neither have worked. Both samples create thin films that can easily be scratched off and I'm trying to use my thin films in electrochemical measurements so they need to last. The current running theory is that the sputtering instrument is too old to produce the clean, low-pressure environment that we need to prevent oxides from forming. Ag was suggested as the adhesive layer because it possibly resists oxide formation better than either Cr or Ti.

Thanks for your help,

Elle

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