I was wondering if anyone has tried to modify the sputtering flux profile within their sputtering system. More specifically, has anyone tried to put some attachment on the gun/target in an attempt to create a thickness gradient along the radius of the rotating substrate? The end goal of this is to be able to sputter several samples of varying thicknesses in one deposition while keeping the substrate rotation on.

I have done so with some success, but did not quite achieve the gradient of thickness we were looking for. I got about 10-15% (nonlinear) gradation of thickness from the center to the outer radius of the substrate holder, which is approximately 9cm in diameter. I did this by covering a little less than half of the target/gun with some foil in a half-moon shape.

Some specifics about our sputtering system: 7 DC or RF powered magnetron guns in a confocal arrangement (sputtering up), 10 degree tilt of the guns, ~20cm working distance

Any ideas? Thoughts? Papers?

Thanks!

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