The careful selection of coatings and substrate materials based on the service exposure of electrical equipment and controls can improve the reliability and cost effectiveness of the entire system.
How is Controlling Corrosion in Electronic Devices?
Corrosion takes place in the final metalization layer of electronic devices such as ICs, and transistors.
This is due to oxidation of metal layer. A cheaper solution is to use Nickel or chromium to minimize this effect. The best solution is to use gold or silver.
As an alloy of copper, brass is susceptible to corrosion when exposed to acidic substances such as chlorides, as well as compounds of nitrogen. Stress corrosion cracking can occur due to a chemical environment and high mechanical stresses. But copper also has advantages, including high electrical conductivity and low overall cost.
Nickel plating is used to protect brass from corrosion. The plating process is prone to defects, such as pinholes and pores, giving highly corrosive substances access to the copper substrate in certain conditions. Nickel is also considered a health risk to those exposed to it. Nickel is even considered a material of concern according to European legislation.
Copper is primarily chosen for its very high current carrying capability and the fact that it doesn't generate heat due to resistance. Electrochemical reactions with oxygen and moisture cause the formation of copper oxide, as well as chlorides, sulfides, and other compounds depending on the chemical contaminants. Oxides as well as other compounds are poor conductors of current. As a result, they increase electrical resistance and heat, and fail to connect or cause flickering. Barrier-type protective coatings are often applied to copper in the form of tin plate on current bars, terminals, and wires. Tin is able to provide protection against the formation of sulfur compounds and oxides.