Does anybody know what organic binders and solvents are used in commercial glass pastes (Ferro Corporation, Schott Glass, SGC, DIMAT) for sealing MEMS (Glass Frit Wafer Bonding process)? I need to reduce the viscosity of glass paste by appropriate solvent.
Hey,
according to the MSDS of Ferro, you will find:
Trimethylpentanediol monoisobutyrate (10%-25%), Terpineol (up to 5%) and Isobutyl methacralate (up to 5%) as main components
Cheers,
Marco
In order to select correctly the additives for your pastes, it is important to know pH of system. The additives should be compatible with pH value of system. In general, the citric acid or FS20 (BASF) can be used to reduce viscosity of acid pastes. On the other hand, if paste pH is anionic, Darvan (Vanderbilt) or FS10, FS60, FS65 (BASF) are recommended. Hope it helps you.
Dear M.Houbould and Vania Regina Selvini,
Thanks for your answers, I will try to reduce the viscosity using this solvents.
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