Hello, I have two ITO targets.
I'm planning to use ITO + Cu + ITO sputtering.
Could I use ITO target for copper deposition?
Normally I put copper side on the sputtering machine, and ITO will be deposited on the sample.
But, I want to put ITO side to the sputtering machine, and Cu will be deposited on the sample.
Is it harmful to ITO target if I put it back side?
Thank you!
So just I understand this correctly: you have one ITO target with a bonded copper backside plate which you now want to use as well?
In that case we have to differentiate between "possible in principle" and "a good idea" of which the latter is probably not the case.
Yes, you can of course sputter your backside plate, but
(1) I wouldn't expect it to be made out of high-purity copper [check specification]; with impurities such layers tend to be useless.
(2) you might run into a cooling issue because sputtering deforms your target surface so the ITO side would not provide a decent thermal contact and your bonding heats up and melts. And cleaning up your chamber after that is no fun at all [plus your target is irreparably gone].
(3) Of course I don't know your setup but it may also happen that the ITO picks up some dirt from the cooling plate which then ends up in your film thus constituting a harm to your process reproducibility.
If your target mounting is somewhat different, please tell us.
Hello,
the thermal conductivity of ITO it in 2 order of magnitude lower than thermal conductivity of copper => do not try it, you would not be able to cool your taget and especially the bonding material (probably indium) would be melted.
It is harmful. Other than that the copper used in the back of ITO target is not such pure.
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