01 June 2023 0 10K Report

I'd like to polish Copper surface on Silicon Wafer.

For Copper Surface, the electroplated thickness is 15um.

I want Polish that surface which flatness is less than 1um and remaining thickness is more than 10um.

I already tried CMP(Allied, MultiPrep), but I couldn't get my wanted result.

Also, For ECP(Electro-chemical Polishing), I also get infeasible possibility from my supervisor.

is there any good Idea to solve this problem?

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