The part of my PhD research is to study the influence of real structure of thin film lithium niobate on kinetics of reactive ion etching.

We use NanoLN lithium niobate on insulator (LNOI) wafers.

Obviously, that SmartCut technology, which used for wafer fabrication, is associated with He-ion irradiation of the structure that leads to formation of structural defects. The high degree of point defects (vacancies and interstitial atoms) cannot be completely eliminated by annealing. There should be dislocation loops formation.

We experimentally revealed (by etch pits methods) that surface dislocation density on LNOI wafers is higher than on bulk LN (CQT wafers).

This affects the etching process in the plasma.

Maybe anybody can share any relevant researches.

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