Hello all,
I am looking at methods to take electrical connections from metal pads on polymer thin films. Our metal pad dimensions are less than 200 micron X 200 micron and therefore, conductive epoxy based bonding methods are ruled out. We have tried wire bonding even with 500 nm thick metal pads on the polymer, but we couldn't succeed. Anybody has expertise in this field? Can somebody suggest which metal at what thickness can be used as the metal pad to achieve successful fire bonding on polymer thin films? If there is any other technique to take electrical contacts out of such devices, those suggestions are also welcome :)
Thanks in advance,
Jose
You mentioned the metal pad. What is it? Gold or silver or copper? Normally we would use gold pads and gold wire to bond them together for electrical property measurements.
We did not use Gold thicker than 300 nm anytime. We have tried Titanium of 500 nm. Both did not work.
What was the thickness of gold pads that you have used? Was it on PVDF or any other polymer?
The thickness of gold pad is around 100nm. It worked for various polymers.
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