I found palladium has good adhesion on surfaces with nitrogen groups. If your process/device permits, you can coat a thin layer of polyimide. I deposited ~200nm Pd on a polyimide film and it cannot be peeled off by scotch tape. It was also stable (no mechanical delamination) when stored in 1M KCl solution for >30 days.

A thin [ < 1micrometer]  coating of Sn or In will work.

Dear Chayanjit Ghosh 

pls check the link.

http://homepages.rpiscrews.us/~wangg/publications/2003_7.pdf\

A thin layer of Sn, In or Ga over Pd.

There’s a very large body of literature on electroless deposition of metals onto self-assembling monolayers (SAMs) bearing exposed catalysts. The SAMs are excellent adhesion layers. Here are some leads: Covalent Binding of Pd Catalysts to Ligating Self‐Assembled Monolayer Films for Selective Electroless Metal Deposition doi: 10.1149/1.2054686; The Evolution of Pd / Sn Catalytic Surfaces in Electroless Copper Deposition doi: 10.1149/1.3536543; Electroless Deposition of Palladium and Platinum https://doi.org/10.1002/9780470602638.ch20. If you are studying the sputtering process, then theses leads won’t be useful, although you might want to look at sputtering onto a SAM.