Dear colleagues,

I am trying to calculate I-V characteristics for typical (Left electrode) - (Device) – (Right electrode) system. Besides the well-known problem of difficult electronic convergence in NEGF, I notice that final atomic forces along transport direction near the electrode-device region increase largely while increasing bias voltage. Please, see dashed ellipses which denote these “problematic atoms” and Trans.fdf file attached.

For instance,

voltage = 0 V: forces ~ 0.005 eV/Ang

voltage = 0.01 V: forces ~ 2.5 eV/Ang

voltage = 0.04 V: forces ~ 10 eV/Ang

voltage = 0.08 V: forces ~ 22 eV/Ang

Other atoms also possess larger forces while increasing bias voltage, but much less than these two “boarder” atomic layers near the device region. Intuitively I can guess that some of my input parameters lead to a wrong seam (inter-connection) of bulk-like electrode and device region.

Maybe some of the following flags (or related to them) are used wrongly:

TS.Elecs.Bulk true

TS.Elecs.DM.Update cross-terms

Or maybe I should modify some TS contours while changing voltage. Now contour definitions are kept constant for each bias.

To be noticed, for each new bias the previous TSDE file is used to accelerate electronic convergence (DM and H criteria) and for each bias it is succesfully converged. But, again, forces become bigger and bigger.

So, would you mind answering two main questions?

1) Do these large forces are really wrong or it’s some methodological artefact and I should simply ignore it?

2) If such force enlargement is a bad symptom, how to fix it?

Thank you in advance for any suggestion or comment.

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