While doing thermal analysis using ansys APDL, we found that in many papers researchers were using SOLID70 element. We tried finding out the difference between different SOLID element types having the capability of performing thermal analysis. But as far as we could see, all the elements types (SOLID5, SOILD70, SOLID69, SOLID90 ,SOLD98 ) give the same results. Even the .rth file size for SOLID5, SOLID70 and SOLID69 are exactly the same.
Can anyone point out why SOLID70 is specifically used for thermal analysis?
The choice of the element depends on your needs. Among those you mentioned, some are specific only for thermal analysis:
SOLID70 : 3-D 8-node Thermal Solid
SOLID90 : 3-D 20-Node Thermal Solid (higher order version of SOLID70)
(after the thermal analysis, you must switch to proper element type, depending on the type of result you need in next simulation: mechanical, electrical, ...)
Other elements are specifically developed for coupled-field simulations (the same element can be used for different fields, thermal, electrical, ...):
SOLID5 : 3-D Coupled-Field Solid
SOLID69: 3-D Coupled Thermal-Electric Solid
SOLID98: 10-node Tetrahedral Coupled-Field Solid (with mid-nodes)
In addition, some elements also differ by the number of nodes, which controls the degree of approximation of finite element solution (broadly speaking, higher n. of nodes means higher accuracy).
If you compare only thermal solutions and you have rather smooth temperature variations, I guess that you'll find very similar results.
D
Dear Denis. Thanks for the reply,
As per my current understanding SOLID5 can take all type of loading scenarios (Thermal, Structural, Electrical and even magnetic loading). And my doubt is why people are using SOLID70/SOLID90 frequently when comes to Thermal-Mechanical Coupled cases, where SOILD5 seems to be more suitable for me.
Is there any thing I am lacking behind like the differences in shape functions used in the element types or something like that which I am not aware of.
with regards,
Kurian
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