Dear Rohit Jha, the essential criterium in selecting the best polymer matrix for board circuits is ' the dimentional stability ' under different stresses, i.e., stresses such thermal, mechanical, and chemical. This criterium is in favor of an unchallenged choice of thermosetting resins. This is in fact the classical approach being followed till nowadays. In addition to that, more recent advances are requiring mainly the flexibility which is lacking in classical thermosets. Nanohybrid composites which fullfill all the classical features of thermosets, they also show other requirements dictated by the newly emerged technological applications. My Regards

PCB includes a mixture of polymers, such as polyethylene, polypropylene, polyurethane and others.

Ref:

Veit, Hugo Marcelo 2015. Electronic Waste. topics in Mining, Metallurgy and Materials Engineering.

You can find more here in this reference.

All the best.

Dear Dr. Rohit Jha,

the substrate most commonly used in printed circuit boards is a glass fiber reinforced (fiberglass) epoxy resin with a copper foil bonded on to one or both sides. PCBs made from paper reinforced phenolic resin with a bonded copper foil are less expensive and are often used in household electrical devices.

The most popular substrate today is probably FR-4. FR-4 is a fiberglass-epoxy laminate that is affordable, a good electrical insulator and is more flame-resistant than fiberglass-only boards.

The resins that are used in the printed circuit board laminates determine the silanes that often are used in printed circuit boards. Since high performance epoxy resins are the most used resins, then an epoxy compatible silane is required. The complex vinylbenzylaminosilane has become the state of the art for this application. Low ionic content (low chloride levels), ease of solubility in treatment baths, and minimization of agglomerates on the electronic glass surface are all important parameters in choice of a silane coupling agent.

For resin systems other than epoxy, or for other epoxy requirements, the glass weavers sometimes apply aminosilanes, epoxysilanes, and chloropropylsilanes.

For more details, please see the sources:

-Printed Circuit Board (Made How – Vol.2)

Available at: http://www.madehow.com/Volume-2/Printed-Circuit-Board.html

-PCB Insulation Materials (2017)

Available at: https://www.mclpcb.com/pcb-insulation-materials/

-Printed Circuit Board Applications

In Applied Plastics Engineering Handbook by Petrr G. Pape (2011)

Best regards, Pierluigi Traverso

I would recommend to take a look in this article

Chapter Polymers in Printed Circuit Board (PCB) and Related Advanced...

read this book

https://books.google.dz/books?id=twTrmFOPqpkC&pg=PA46&lpg=PA46&dq=Which+type+of+polymer+is+used+in+base+boards+of+Printed+Circuit+Boards+(PCBs)?&source=bl&ots=c5mqgDnOOR&sig=ACfU3U2cTGxWsOSSDkoT1DJrJV8opGjWIg&hl=fr&sa=X&ved=2ahUKEwjNl-nJ49TpAhXT8uAKHQW2DQUQ6AEwDHoECAwQAQ#v=onepage&q=Which%20type%20of%20polymer%20is%20used%20in%20base%20boards%20of%20Printed%20Circuit%20Boards%20(PCBs)%3F&f=false

Dear Rohit Jha, the essential criterium in selecting the best polymer matrix for board circuits is ' the dimentional stability ' under different stresses, i.e., stresses such thermal, mechanical, and chemical. This criterium is in favor of an unchallenged choice of thermosetting resins. This is in fact the classical approach being followed till nowadays. In addition to that, more recent advances are requiring mainly the flexibility which is lacking in classical thermosets. Nanohybrid composites which fullfill all the classical features of thermosets, they also show other requirements dictated by the newly emerged technological applications. My Regards

Hi;

Here are some polymers mainly used in Printed Circuit Boards (PCBs):

Epoxide resin, acrylates, polyamides, poly(ethersulfone) (PES), polyetherimide (PEI), poly(phenylene sulfide) (PPS) or less frequently polyethylene terephthalates.

With my best regards

Dear Rohit,

A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate. The basic task is to attain the sufficient mechanical strength.

Epoxy, polyamides or polyethylene terephthalates and polyethylene naphthalates are quite useful polymers for the base board of PCB. The substrate most commonly used in printed circuit boards is a glass fiber reinforced (fiberglass) epoxy resin with a copper foil bonded on to one or both sides. Epoxy produce substantial mechanical strength with a copper foil and compatibility as well. The primary side could also be called the top side, and corresponds more exactly to the component side when doing a through-hole board with all components on the sameside. The secondary side could also be called the bottom side, or more exactly the solder side, with a through-hole board. The boards are made by using much thinner individual boards, one for each layer, and these are then bonded together to produce the overall PCB. As the number of layers increases, so the individual boards must become thinner to prevent the finished PCB from becoming too thick.

Ashish

Epoxy with glass fibers

Dear Rohit,

I recommend you look at or obtain the latest edition of The Printed Circuit Handbook, published by McGraw Hill and edited by Clyde Coombs, Jr. and Happy Holden. If you could be more specific, perhaps I can further assist you.

Correct, primarily glass fiber reinforced epoxy also call FR4 for short. Some PCB boards are made from CCL and even alumina of high thermal conductivity to manage heat dissipation.

variety of polymers have been used to manufacture PC board:mainly phenolic based,epoxy based, polyimide based.

Mr. Lee's answer is the one I'm familiar with, but there is a move to customize PC board properties with specific PC engineering architectures. For example, there are efforts to modify SU-8 (bisphenol-A novolac) with heat conducting materials, nanoparticles with specific properties and flexibilizing polymers, to boost thermal conductivity, electrical resistance, and to alter board structural properties consistent with denser architectures.

Dear ,

Many kinds of polymers among epoxide resin, acrylates, polyamides, poly (ethersulfone) (PES), polyetherimide (PEI), poly(phenylene sulfide) (PPS) or less frequently polyethylene terephthalates can be used according to different stresses ,e.g thermal stress, stress. please read any basic book on PCBs designing. Thanks

Epoxide resin, acrylates, polyamides