Hi Shamjid,

some years ago I had to structure CuPc thin films. It could successfully done with the "lift off" process. That works on substrates. We developed a photoresist pattern on the substrate. Than we coated the CuPc thin film on the substrate / on the photoresist. After coating we stripped the pattern of the resist together with the CuPc film. The CuPc on the substrat was very stable. In that way we structured it without any etching. Maybe it helps you.