I made 200nm perovskite oxide film on the top of the Pt-coated Si substrate, and then deposit the 0.5mm diameter Pt(Platinum) electrodes on the top to measure the permittivity of the film.
Si/SiO2/TiO2/Pt/Oxide film/Pt
but when I did the silver wire bonding and tried to take the measurements I came to know that my film have become completely short circuit and conductive everywhere.
Would anybody please tell me, what could be the reason behind that mess?
Dear Waseem,
welcome,
Before to blame the silver bonding you have to check that your Pt perovskite film Pt does not have any short during deposition eg because of pinholes or overlapping of the upper Pt an lower Pt layers.
Then can be accomplished by using mechanical pressure probes.
If this is okay then one has to know your wire bond the Pt electrodes to Ag wires.
As a proposal to avoid any ultrasound pressure in wire bonding you may use bond the silver wires by a spot of silver epoxy.
Or you may need to post anneal the structure to strengthen the perovskite film. You may reduce the bonding energy not to break the film.
Best wishes
Why the TiO2 layer underneath the lower Pt layer? Pt adheres well to SiO2 while the TiO2 layer is mechanically vulnerable and might collapse when pressure is excerted during bonding - ruining the whole structure.
I suggest to follow Prof. Zekry's advice to "bond" using silver epoxy glue and to avoid any mechanical loading.
Waseem,
If you are certain that the Ag wire bonds fail, then you could optimize bonding process to reduce loads on the stacked structures and still have a bonded region. I would recommend you to start with the bonding parameters shown in the attached article.
Good luck,
Subramani
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