I am going to deposit Titanium nitride(TiN) on glass inside the vacuum chamber having temperature of about 200 degree Celsius in the presence of gases like Nitrogen and argon, in what amount should these gases be released into the vacuum chamber to get the best deposition of Titanium nitride on glass or what are the best methods by which i can determine the amount of gases (nitrogen and argon) to make Titanium nitride deposit on my glass.What should be the stoichiometry of these gases to get the best possible results?
* Vacuum chamber size =3ft*4ft
Hello Raghav.
When obtaining TiN, the nitrogen partial pressure in vacuum chamber must be Pn = 2 ÷ 2.5 * 10-2 Pa. on working evaporator!
Good luck.
Konstantin.
Thank you sir ,but could you please elaborate your answer or if you have any article's link as i am unable to completely understand this please share with me. I would be very grateful to you.
Hello Raghav.
Typically, Magnetron or ARC method for generating Ti ions used to produce a TiN coating on the glass surface. In plasma`s flow of Ti ions introduce nitrogen, methane or oxygen, get, nitrides, carbides, oxides of Ti. Ar is used as plasma-forming gas, and N, CH, O, as reaction gases.
To obtain TiN using a thermal evaporation method, it is necessary to ionize N2 in vacuum chamber simultaneously with evaporation of Ti.
It can be ionized in vacuum chamber by glow discharge or by means gas plasma generator with closed electron drift.
In case ionization of N2 by means glow discharge, it is necessary to make gas mixture Ar and N2 and maintain pressure at which glow discharge burns lower limit Pmin = 1 Pa.
In this gas mixture, proportion of N2 should be 0.025 ÷ 0.02 parts.
I hope this information was useful to you
B.R.
Konstantin.
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