What is the stress of PVD layers deposited on glass substrates heated to 280C of the following materials: TiO2, Ta2O5, Sio2 and MgF2?
It would be hard to have an answer to this untill you do not know the parameters of depoistion like, depoistion rate, thickness of the films deposited etc.
Well if you assume the films are stress-free when deposited you can get an estimate by looking at the thermal expansion coefficient difference between those materials and your glass, and multiplying by the temperature difference when cooling to room temperature (so ~260K). However it's not an exact science because the literature values may not represent exactly the behaviour of your PVD films.
What is the PVD technique used? Ionic sputtering, Magnetron, e-beam...? With magnetron and sputtering some thin films of oxide deposited even at 700°C exhibit a residual stress around 5 GPa. They are many well documented reasons for that.
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