The fluid flow of argon in a nanochannel with copper walls is simulated by molecular dynamics.

In this simulation, the lower copper wall is fixed and the upper copper wall moves at a fix rate. The temperature of the lower copper wall is 90K and the upper copper wall temperature is 190K and between the two walls liquid argon flows at temperature of 90K.

Argon-Argon and copper-Argon interactions is simulated by Lennard-Jones potential and EAM potential has been used for copper-copper interactions.

At the bottom of the lower fixed wall and above the movable upper wall, two fixed walls are simulated.

After applying the velocity and fixes of the groups of this couette flow, argon molecules diffuse into the copper plates.

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