Hello,
I am wondering what is the advantage and drawbacks of indium over silver paste for connecting thin wires to the pads of metallic electrodes?
Thanks
Elchin hi, hhere is a few remarks:
* You should be sure that your material does not interact with silver or indium.
*Indium is universal low temperature alloy solder (~120 *C -- 160 *C) that could works well at low temperature. But it possible find more low temperature, below 100 *C (table: https://www.indium.com/blog/a-guide-to-low-temperature-solder-alloys.php or https://en.wikipedia.org/wiki/Solder_alloys)
* Frequently, indium contacts could create non-ohmic contacts // not linear behavior. it should be checked.
* silver paste is fast solution without sample overheating but it is quite dirty and it is easy create short-circuit. Also if soldered material could oxidized, the silver past soldering could lost properties with time, because there will be oxide film between silver and other material
*mechanically soldering by indium will be little bit stronger than gluing by silver paste
good luck
Hi Dmytro,
Thank you so much for the helpful comments, and the link shared. I recently tried both silver paste and indium, and both worked well in my experience. However, since I test my samples at room temperature, the indium solder is better.
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