I am processing 200um borosilicate wafers that have patterns etched through using an excimer laser. The wafers are later used for anodic bonding with silicon. Currently, I do acetone, IPA, and water, then Piranha solution to do post-laser cleaning to remove the particles generated from laser plume, but could not get a clean anodic bonding. I tried to add ultrasonication to the cleaning steps but due to the fact that the wafers are so thin and large openings patterned, the wafers are so fragile that they will break during sonication. Are there other good methods to remove particles from these fragile glass wafers without breaking them?

Thanks in advance.

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