SiC deposited on Si using PECVD and annealed using Tempress Dry furnace. I did XPS and found SiO2 peak very prominent, more so than Si and C peaks.
SiO2 is the native oxide of SiC. You can etch it using HF, but it will oxidize quickly again in atmosphere. If you want to do layer process, then you can first reduce it at high temperature in controlled atmosphere and continue the process.
Annealed at 800 degrees for 25min and thickness is 100nm
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