Hi All,

I am using PVD DC sputtering to dep Cu and Ti (adhesion) on glass. The film Thickness is between 3 and 5 um.

1- I would like to know how much of stress is OK? meaning it will cause any issues down the line.

2- What are the best knobs to reduce the film stress? Pressure, flow, substrate/target distance, power...

3- Heating occurs during deposition, will depp`ing the film in increments (letting the substarte cool down) help with the film stress? I don`t have a way to cool the substrate down during deposition.

4- Any other suggestions/recommendations???

appreciate your time